Newly developed ultra thin fan-out wafer level package for PoP usage.

Details

Language :

English

ISBNs :

9784904090114

Database :

Complementary Index

Journal :

2014 International Conference on Electronics Packaging (ICEP)

Publication Type :

Conference

Accession number :

98459097

Full Text :

https://doi.org/10.1109/ICEP.2014.6826655