Transient Characterization of Hybrid Microfluidic-Thermoelectric Cooling Scheme for Dynamic Thermal Management of Microprocessor.

Details

Language :

English

ISSN :

10437398

Volume :

136

Issue :

3

Database :

Complementary Index

Journal :

Journal of Electronic Packaging

Publication Type :

Academic Journal

Accession number :

97925155

Full Text :

https://doi.org/10.1115/1.4027901