Cite
Design and fabrication of a mems test socket with an attached tip for a ball-grid-array integrated circuit package.
MLA
Kim, Sangwon, et al. “Design and Fabrication of a Mems Test Socket with an Attached Tip for a Ball-Grid-Array Integrated Circuit Package.” Journal of Mechanical Science & Technology, vol. 28, no. 7, July 2014, pp. 2807–14. EBSCOhost, https://doi.org/10.1007/s12206-014-0634-0.
APA
Kim, S., Lee, J., Nam, J., Kim, B., Cho, C., Kim, J., & Choi, H. (2014). Design and fabrication of a mems test socket with an attached tip for a ball-grid-array integrated circuit package. Journal of Mechanical Science & Technology, 28(7), 2807–2814. https://doi.org/10.1007/s12206-014-0634-0
Chicago
Kim, Sangwon, Junman Lee, Jaewoo Nam, Bonghwan Kim, Chanseob Cho, Jung Kim, and Hongsoo Choi. 2014. “Design and Fabrication of a Mems Test Socket with an Attached Tip for a Ball-Grid-Array Integrated Circuit Package.” Journal of Mechanical Science & Technology 28 (7): 2807–14. doi:10.1007/s12206-014-0634-0.