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Enhancing thermoelectric properties of Cu1.8+xSe compounds.

Authors :
Zou, Liang
Zhang, Bo-Ping
Ge, Zhen-Hua
Zhang, Li-Juan
Source :
Journal of Materials Research; May2014, Vol. 29 Issue 9, p1047-1053, 7p
Publication Year :
2014

Abstract

P-type Cu1.8+xSe (x = 0, 0.16, 0.20) compounds were synthesized by mechanical alloying and spark plasma sintering technique. A 100% enhancement of the Seebeck coefficient was achieved in the whole temperature interval for x = 0.16 and x = 0.20 bulks compared with that of the x = 0 bulk. The thermal conductivity was all below 1.6 W m−1 K−1 in the whole temperature interval for x = 0.16 and x = 0.20 bulks, showing a pronounced reduction compared with that of the x = 0 bulk. The lowest thermal conductivity 0.69 W m−1 K−1 was achieved in the x = 0.16 sample at 773 K, whereby a maximum ZT value of 1.23 was obtained, revealing that optimizing Cu content in Cu1.8+xSe system is an effective method to improve the thermoelectric (TE) merit and indicating a great potential for TE application along with their nontoxicity and low cost. [ABSTRACT FROM AUTHOR]

Details

Language :
English
ISSN :
08842914
Volume :
29
Issue :
9
Database :
Complementary Index
Journal :
Journal of Materials Research
Publication Type :
Academic Journal
Accession number :
96010469
Full Text :
https://doi.org/10.1557/jmr.2014.90