Formation of nearly void-free Cu3Sn intermetallic joints using nanotwinned Cu metallization.

Cu₃Sn intermetallic compounds (IMCs) are more resistant to fracture than solders. In addition, the Cu₃Sn IMCs are more conductive than the solders. In this study, we manufactured Cu₃Sn IMCs to serve as a joint using electroplated nanotwinned Cu as a metallization layer to react with pure Sn at 260 °C and 340 °C. The results show that there were almost no Kirkendall voids generated inside the Cu3Sn layer. In addition, the kinetics of the Cu₃Sn growth was analyzed to predict the time needed to form the Cu₃Sn joint. [ABSTRACT FROM AUTHOR]