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Dynamic Self-Repair Architectures for Defective Through-silicon Vias.
- Source :
- ETRI Journal; Apr2014, Vol. 36 Issue 2, p301-308, 8p
- Publication Year :
- 2014
-
Abstract
- Three-dimensional integration technology results in area savings, platform power savings, and an increase in performance. Through-silicon via (TSV) assembly and manufacturing processes can potentially introduce defects. This may result in increases in manufacturing and test costs and will cause a yield problem. To improve the yield, spare TSVs can be included to repair defective TSVs. This paper proposes a new built-in self-test feature to identify defective TSV channels. For defective TSVs, this paper also introduces dynamic self-repair architectures using code-based and hardware-mapping based repair. [ABSTRACT FROM AUTHOR]
Details
- Language :
- English
- ISSN :
- 12256463
- Volume :
- 36
- Issue :
- 2
- Database :
- Complementary Index
- Journal :
- ETRI Journal
- Publication Type :
- Academic Journal
- Accession number :
- 95498059
- Full Text :
- https://doi.org/10.4218/etrij.14.0113.0578