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Electrodeposition and characterization of nickel-copper metallic foams for application as electrodes for supercapacitors.

Authors :
Eugénio, S.
Silva, T.
Carmezim, M.
Duarte, R.
Montemor, M.
Source :
Journal of Applied Electrochemistry; Apr2014, Vol. 44 Issue 4, p455-465, 11p, 2 Black and White Photographs, 1 Diagram, 1 Chart, 5 Graphs
Publication Year :
2014

Abstract

Nickel-copper metallic foams were electrodeposited from an acidic electrolyte, using hydrogen bubble evolution as a dynamic template. Their morphology and chemical composition was studied by scanning electron microscopy and related to the deposition parameters (applied current density and deposition time). For high currents densities (above 1 A cm) the nickel-copper deposits have a three-dimensional foam-like morphology with randomly distributed nearly-circular pores whose walls present an open dendritic structure. The nickel-copper foams are crystalline and composed of pure nickel and a copper-rich phase containing nickel in solid solution. The electrochemical behaviour of the material was studied by cyclic voltammetry and chronopotentiometry (charge-discharge curves) aiming at its application as a positive electrode for supercapacitors. Cyclic voltammograms showed that the Ni-Cu foams have a pseudocapacitive behaviour. The specific capacitance was calculated from charge-discharge data and the best value (105 F g at 1 mA cm) was obtained for nickel-copper foams deposited at 1.8 A cm for 180 s. Cycling stability of these foams was also assessed and they present a 90 % capacitance retention after 10,000 cycles at 10 mA cm. [ABSTRACT FROM AUTHOR]

Details

Language :
English
ISSN :
0021891X
Volume :
44
Issue :
4
Database :
Complementary Index
Journal :
Journal of Applied Electrochemistry
Publication Type :
Academic Journal
Accession number :
94800365
Full Text :
https://doi.org/10.1007/s10800-013-0646-y