Cite
Improved sidewall doping of extensions by AsH3 ion assisted deposition and doping (IADD) with small implant angle for scaled NMOS Si bulk FinFETs.
MLA
Sasaki, Y., et al. “Improved Sidewall Doping of Extensions by AsH3 Ion Assisted Deposition and Doping (IADD) with Small Implant Angle for Scaled NMOS Si Bulk FinFETs.” 2013 IEEE International Electron Devices Meeting, Jan. 2013, p. 20.6.1-20.6.4. EBSCOhost, https://doi.org/10.1109/IEDM.2013.6724671.
APA
Sasaki, Y., Godet, L., Chiarella, T., Brunco, D. P., Rockwell, T., Lee, J. W., Colombeau, B., Togo, M., Chew, S. A., Zschaetszch, G., Noh, K. B., De Keersgieter, A., Boccardi, G., Kim, M. S., Hellings, G., Martin, P., Vandervorst, W., Thean, A., & Horiguchi, N. (2013). Improved sidewall doping of extensions by AsH3 ion assisted deposition and doping (IADD) with small implant angle for scaled NMOS Si bulk FinFETs. 2013 IEEE International Electron Devices Meeting, 20.6.1-20.6.4. https://doi.org/10.1109/IEDM.2013.6724671
Chicago
Sasaki, Y., L. Godet, T. Chiarella, D. P. Brunco, T. Rockwell, J. W. Lee, B. Colombeau, et al. 2013. “Improved Sidewall Doping of Extensions by AsH3 Ion Assisted Deposition and Doping (IADD) with Small Implant Angle for Scaled NMOS Si Bulk FinFETs.” 2013 IEEE International Electron Devices Meeting, January, 20.6.1-20.6.4. doi:10.1109/IEDM.2013.6724671.