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A novel flexible on-die decoupling scheme using package interconnects.
- Source :
- 2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging & Systems; 2013, p155-158, 4p
- Publication Year :
- 2013
-
Abstract
- Power supply noise induced jitter (PSIJ) is one of the critical bottlenecks for I/O signal performance. Good power distribution network (PDN) is a must for high-end system designs. Due to design limitation in die and package, providing sufficient on-die capacitor (ODC) or on-package capacitor (OPD) is a very challenging task. This paper presents a novel on-die decoupling scheme which places decoupling caps in core area and connects to I/O area by package interconnects. The presented method is applied to DDR interface in med-end FPGA devices. Excellent SSN improvement is achieved by implementing this scheme. [ABSTRACT FROM PUBLISHER]
Details
- Language :
- English
- ISBNs :
- 9781479907052
- Database :
- Complementary Index
- Journal :
- 2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging & Systems
- Publication Type :
- Conference
- Accession number :
- 94521279
- Full Text :
- https://doi.org/10.1109/EPEPS.2013.6703488