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Microstructure-electromigration correlation in a thin stripe of eutectic SnPb solder stressed between Cu electrodes.
- Source :
- Applied Physics Letters; 7/5/1999, Vol. 75 Issue 1, p58, 3p
- Publication Year :
- 1999
-
Abstract
- Room-temperature electromigration occurs in a thin stripe of eutectic SnPb solder stressed by a current density of 10[sup5] amp/cm[sup2]. Hillocks and voids grow at the anode and the cathode, respectively. While the dominant diffusion species in Sn in this two-phase alloy, the growth of the hillocks, surprisingly, originates from the Pb grains. [ABSTRACT FROM AUTHOR]
- Subjects :
- ELECTRODIFFUSION
SEMICONDUCTOR doping
TEMPERATURE
THERMAL properties
Subjects
Details
- Language :
- English
- ISSN :
- 00036951
- Volume :
- 75
- Issue :
- 1
- Database :
- Complementary Index
- Journal :
- Applied Physics Letters
- Publication Type :
- Academic Journal
- Accession number :
- 9416924
- Full Text :
- https://doi.org/10.1063/1.124276