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Fast Growing Market for MEMS Packaging Moves Towards 3D WLP, Multi-Sensor Combos, and Common Platforms.
- Source :
- Advancing Microelectronics; sep/oct2013, Vol. 40 Issue 5, p16-18, 3p
- Publication Year :
- 2013
-
Abstract
- The article discusses the rapid growth for microelectromechanical systems (MEMS) packaging business in the U.S. It emphasizes the demand for smaller devices and shorter interconnection that drives MEMS packaging to more direct bonding and three dimensional (3D) connections. It cites the 20% average growth in MEMS packaging business which worth up to 9 billion unit volume.
Details
- Language :
- English
- ISSN :
- 23807008
- Volume :
- 40
- Issue :
- 5
- Database :
- Complementary Index
- Journal :
- Advancing Microelectronics
- Publication Type :
- Periodical
- Accession number :
- 93651744