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A new packaging technique using a film carrier for laser diode arrays.

Authors :
Usui, M.
Katsura, K.
Hayashi, T.
Hosoya, M.
Sato, K.
Sekine, S.
Toba, H.
Source :
IEEE Transactions on Components, Packaging & Manufacturing Technology, Part B; 1994, Vol. 17 Issue 3, p395-401, 7p
Publication Year :
1994

Details

Language :
English
ISSN :
10709894
Volume :
17
Issue :
3
Database :
Complementary Index
Journal :
IEEE Transactions on Components, Packaging & Manufacturing Technology, Part B
Publication Type :
Academic Journal
Accession number :
93246416
Full Text :
https://doi.org/10.1109/96.311789