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Automated design tool for examining microelectronic packaging design alternatives.

Authors :
Siew-Wei Chin
Rajan, S.D.
Nagaraj, B.K.
Mahalingam, M.
Source :
IEEE Transactions on Components, Packaging & Manufacturing Technology, Part B; 1994, Vol. 17 Issue 1, p76-82, 7p
Publication Year :
1994

Details

Language :
English
ISSN :
10709894
Volume :
17
Issue :
1
Database :
Complementary Index
Journal :
IEEE Transactions on Components, Packaging & Manufacturing Technology, Part B
Publication Type :
Academic Journal
Accession number :
93246375
Full Text :
https://doi.org/10.1109/96.296434