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The Microelectronic Wire Bond Pull Test-How to use It, How to Abuse It.
- Source :
- IEEE Transactions on Components, Hybrids & Manufacturing Technology; 1978, Vol. 1 Issue 3, p203-210, 8p
- Publication Year :
- 1978
Details
- Language :
- English
- ISSN :
- 01486411
- Volume :
- 1
- Issue :
- 3
- Database :
- Complementary Index
- Journal :
- IEEE Transactions on Components, Hybrids & Manufacturing Technology
- Publication Type :
- Academic Journal
- Accession number :
- 93005176
- Full Text :
- https://doi.org/10.1109/TCHMT.1978.1135290