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On composition of mechatronic components enabled by interoperability and portability provisions of IEC 61499: A case study.

Authors :
Patil, Sandeep
Yan, Jeffrey
Vyatkin, Valeriy
Pang, Cheng
Source :
2013 IEEE 18th Conference on Emerging Technologies & Factory Automation (ETFA); 2013, p1-4, 4p
Publication Year :
2013

Details

Language :
English
ISBNs :
9781479908646
Database :
Complementary Index
Journal :
2013 IEEE 18th Conference on Emerging Technologies & Factory Automation (ETFA)
Publication Type :
Conference
Accession number :
92916779
Full Text :
https://doi.org/10.1109/ETFA.2013.6648136