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Soft-breakdown damage in MOSFET's due to high-density plasma etching exposure.

Authors :
Okandan, M.
Fonash, S.J.
Awadelkarim, O.O.
Chan, Y.D.
Preuninger, F.
Source :
IEEE Electron Device Letters; 1996, Vol. 17 Issue 8, p388-390, 3p
Publication Year :
1996

Details

Language :
English
ISSN :
07413106
Volume :
17
Issue :
8
Database :
Complementary Index
Journal :
IEEE Electron Device Letters
Publication Type :
Academic Journal
Accession number :
92796477
Full Text :
https://doi.org/10.1109/55.511584