0.5-/spl mu/m-pitch copper-dual-damascene metallization using organic SOG (k=2.9) for 0.18-/spl mu/m CMOS applications.

Details

Language :

English

ISBNs :

9780780354104

Database :

Complementary Index

Journal :

International Electron Devices Meeting 1999 Technical Digest (Cat No99CH36318)

Publication Type :

Conference

Accession number :

92555820

Full Text :

https://doi.org/10.1109/IEDM.1999.824229