Interconnection formation by simultaneous copper doping in chemical-vapor-deposited aluminum (Al-Cu CVD).

Details

Language :

English

ISBNs :

9780780314504

Database :

Complementary Index

Journal :

Proceedings of IEEE International Electron Devices Meeting

Publication Type :

Conference

Accession number :

92489519

Full Text :

https://doi.org/10.1109/IEDM.1993.347352