Packaging requirements and solutions for CMOS imaging sensors.

Authors :: Sengupta, K.
Sundahl, R.
Kawashima, S.
Arellano, R.
Sklenicka, C.
Thompson, D.
Source :: Twenty Third IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat No98CH36205); 1998, p194-198, 5p
Publication Year :: 1998

Language :: English
ISBNs :: 9780780345232
Database :: Complementary Index
Journal :: Twenty Third IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat No98CH36205)
Publication Type :: Conference
Accession number :: 92362354
Full Text :: https://doi.org/10.1109/IEMT.1998.731075