A submicron, double level metal process for high density memory applications.

Authors :: Whitwer, F.
Milligan, D.
Garner, J.
Sun, S.-P.
Shenasa, M.
Davies, T.
Lage, C.
Source :: Seventh International IEEE Conference on VLSI Multilevel Interconnection; 1990, p49-54, 6p
Publication Year :: 1990

Language :: English
Database :: Complementary Index
Journal :: Seventh International IEEE Conference on VLSI Multilevel Interconnection
Publication Type :: Conference
Accession number :: 92349954
Full Text :: https://doi.org/10.1109/VMIC.1990.127842