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High yield multichip modules based on minimal IC pretest.

Authors :
Burdick, W.
Daum, W.
Source :
Proceedings, International Test Conference; 1994, p30-40, 11p
Publication Year :
1994

Details

Language :
English
ISBNs :
9780780321038
Database :
Complementary Index
Journal :
Proceedings, International Test Conference
Publication Type :
Conference
Accession number :
92344959
Full Text :
https://doi.org/10.1109/TEST.1994.527933