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BLO/spl kappa//sup TM/-a low-/spl kappa/ dielectric barrier/etch stop film for copper damascene applications.
- Source :
- Proceedings of the IEEE 1999 International Interconnect Technology Conference (Cat No99EX247); 1999, p109-111, 3p
- Publication Year :
- 1999
Details
- Language :
- English
- ISBNs :
- 9780780351745
- Database :
- Complementary Index
- Journal :
- Proceedings of the IEEE 1999 International Interconnect Technology Conference (Cat No99EX247)
- Publication Type :
- Conference
- Accession number :
- 92320877
- Full Text :
- https://doi.org/10.1109/IITC.1999.787093