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Impact of low pressure long throw sputtering method on submicron copper metallization.
- Source :
- Proceedings of the IEEE 1998 International Interconnect Technology Conference (Cat No98EX102); 1998, p160-162, 3p
- Publication Year :
- 1998
Details
- Language :
- English
- ISBNs :
- 9780780342859
- Database :
- Complementary Index
- Journal :
- Proceedings of the IEEE 1998 International Interconnect Technology Conference (Cat No98EX102)
- Publication Type :
- Conference
- Accession number :
- 92320348
- Full Text :
- https://doi.org/10.1109/IITC.1998.704779