The mini flex ball-grid-array chip-scale package.

Authors :: Ang, S.
Meyer, D.
Thach, T.
Schaper, L.
Brown, W.D.
Source :: Proceedings of 2nd Electronics Packaging Technology Conference (Cat No98EX235); 1998, p13-17, 5p
Publication Year :: 1998

Language :: English
ISBNs :: 9780780351417
Database :: Complementary Index
Journal :: Proceedings of 2nd Electronics Packaging Technology Conference (Cat No98EX235)
Publication Type :: Conference
Accession number :: 92282473
Full Text :: https://doi.org/10.1109/EPTC.1998.755972