Packaging properties of ALIVH-CSP using SBB flip-chip bonding technology.

Authors :: Itagaki, M.
Amami, K.
Tomura, Y.
Yuhaku, S.
Noda, O.
Bessho, Y.
Eda, K.
Ishida, T.
Source :: Proceedings 1998 International Conference on Multichip Modules & High Density Packaging (Cat No98EX154); 1998, p236-241, 6p
Publication Year :: 1998

Language :: English
ISBNs :: 9780780348509
Database :: Complementary Index
Journal :: Proceedings 1998 International Conference on Multichip Modules & High Density Packaging (Cat No98EX154)
Publication Type :: Conference
Accession number :: 92227399
Full Text :: https://doi.org/10.1109/ICMCM.1998.670786