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Silicon wafer bonding for sealed vacuum microelectronic devices.
- Source :
- IVMC '95 Eighth International Vacuum Microelectronics Conference Technical Digest (Cat NoTH8012); 1995, p159-163, 5p
- Publication Year :
- 1995
Details
- Language :
- English
- ISBNs :
- 9780780321434
- Database :
- Complementary Index
- Journal :
- IVMC '95 Eighth International Vacuum Microelectronics Conference Technical Digest (Cat NoTH8012)
- Publication Type :
- Conference
- Accession number :
- 92195805
- Full Text :
- https://doi.org/10.1109/IVMC.1995.487015