Fatigue-strength prediction of microelectronics solder joints under thermal cyclic loading.

Details

Language :

English

ISBNs :

9780780333253

Database :

Complementary Index

Journal :

InterSociety Conference on Thermal Phenomena in Electronic Systems, I-THERM V

Publication Type :

Conference

Accession number :

92191846

Full Text :

https://doi.org/10.1109/ITHERM.1996.534556