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Micro electronic packaging technologies: status and trends.

Authors :
zur Nieden, T.
Source :
CompEuro 1992 Proceedings Computer Systems & Software Engineering; 1992, p292-297, 6p
Publication Year :
1992

Details

Language :
English
ISBNs :
9780818627606
Database :
Complementary Index
Journal :
CompEuro 1992 Proceedings Computer Systems & Software Engineering
Publication Type :
Conference
Accession number :
92160557
Full Text :
https://doi.org/10.1109/CMPEUR.1992.218418