Back to Search
Start Over
Assembly techniques related to die crack in high power dissipation MDIPs.
- Source :
- 38th Electronics Components Conference 1988, Proceedings; 1988, p45-48, 4p
- Publication Year :
- 1988
Details
- Language :
- English
- Database :
- Complementary Index
- Journal :
- 38th Electronics Components Conference 1988, Proceedings
- Publication Type :
- Conference
- Accession number :
- 92148760
- Full Text :
- https://doi.org/10.1109/ECC.1988.12568