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A new composite substrate with high thermal conductivity for power modules.
- Source :
- 2nd 1998 IEMT/IMC Symposium (IEEE Cat No98EX225); 1998, p321-326, 6p
- Publication Year :
- 1998
Details
- Language :
- English
- ISBNs :
- 9780780350908
- Database :
- Complementary Index
- Journal :
- 2nd 1998 IEMT/IMC Symposium (IEEE Cat No98EX225)
- Publication Type :
- Conference
- Accession number :
- 92146799
- Full Text :
- https://doi.org/10.1109/IEMTIM.1998.704668