Application of via post interconnection for build up printed circuit board.

Details

Language :

English

ISBNs :

9780780350908

Database :

Complementary Index

Journal :

2nd 1998 IEMT/IMC Symposium (IEEE Cat No98EX225)

Publication Type :

Conference

Accession number :

92146797

Full Text :

https://doi.org/10.1109/IEMTIM.1998.704666