Diamond wafer for SAW application.

Authors :: Fujii, S.
Seki, Y.
Yoshida, K.
Nakahata, H.
Higaki, K.
Kitabayashi, H.
Shikata, S.
Source :: 1997 IEEE Ultrasonics Symposium Proceedings An International Symposium (Cat No97CH36118); 1997, Issue 1, p183-183, 1p
Publication Year :: 1997

Language :: English
ISBNs :: 9780780341531
Issue :: 1
Database :: Complementary Index
Journal :: 1997 IEEE Ultrasonics Symposium Proceedings An International Symposium (Cat No97CH36118)
Publication Type :: Conference
Accession number :: 92121044
Full Text :: https://doi.org/10.1109/ULTSYM.1997.663006