Failure mechanism of solidification cracks in semiconductor laser packaging.

Authors :: Chen, J.C.
Chen, W.T.
Chang, S.T.
Horng, J.S.
Lin, H.H.
Sun, M.J.
Wang, W.H.
Cheng, W.H.
Source :: 1996 Proceedings 46th Electronic Components & Technology Conference; 1996, p946-950, 5p
Publication Year :: 1996

Language :: English
ISBNs :: 9780780332867
Database :: Complementary Index
Journal :: 1996 Proceedings 46th Electronic Components & Technology Conference
Publication Type :: Conference
Accession number :: 92113436
Full Text :: https://doi.org/10.1109/ECTC.1996.550760