Thermal analysis and modelling of a copper-polyimide thin-film-on-silicon multichip module packaging technology.

Details

Language :

English

ISBNs :

9780780305007

Database :

Complementary Index

Journal :

1992 Proceedings Eighth Annual IEEE Semiconductor Thermal Measurement & Management Symposium

Publication Type :

Conference

Accession number :

92087573

Full Text :

https://doi.org/10.1109/STHERM.1992.172857