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Data Mining Approaches for Packaging Yield Prediction in the Post-fabrication Process.

Authors :
Park, Seung Hwan
Park, Cheong-Sool
Kim, Jun Seok
Kim, Sung-Shick
Baek, Jun-Geol
An, Daewoong
Source :
2013 IEEE International Congress on Big Data; 2013, p363-368, 6p
Publication Year :
2013

Details

Language :
English
ISBNs :
9780769550060
Database :
Complementary Index
Journal :
2013 IEEE International Congress on Big Data
Publication Type :
Conference
Accession number :
91789005
Full Text :
https://doi.org/10.1109/BigData.Congress.2013.55