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Reliability study for large silicon interposers report on board.

Authors :
Ferrandon, C.
Joblot, S.
Lamy, Y.
Coudrain, P.
Bar, P.
Yap, D.
De Crecy, F.
Coffy, R.
Carpentier, J-F.
Simon, G.
Source :
2013 IEEE 63rd Electronic Components & Technology Conference; 2013, p383-389, 7p
Publication Year :
2013

Details

Language :
English
ISBNs :
9781479902330
Database :
Complementary Index
Journal :
2013 IEEE 63rd Electronic Components & Technology Conference
Publication Type :
Conference
Accession number :
90161464
Full Text :
https://doi.org/10.1109/ECTC.2013.6575599
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