Fabrication of laterally driven bulk titanium devices on titanium-on-glass wafers.

In this study, a sandwiched titanium-on-glass (TOG) substrate was used to fabricate laterally driven microelectromechanical systems devices with bulk titanium as the structural material. 4" TOG wafers with a titanium device layer of 25 μm were fabricated by low temperature SU-8 wafer bonding and chemical mechanical polishing. By using inductively coupled plasma for titanium deep etching as well as dry release, suspended high-aspect-ratio bulk titanium structures were realized with only one mask. A laterally driven electrostatic comb-driven bulk titanium resonator was manufactured as a preliminary demonstration. The resonator achieves a quality factor of 110 at 34 kHz, and survived 10 000 g shock without damage. Due to the high mechanical endurance and excellent corrosion resistance of titanium, TOG technology may open up many new applications in harsh environments. [ABSTRACT FROM AUTHOR]