Microstructure local effect for electromigration reliability improvement and Cu damascene lines design rules relaxation.

Details

Language :

English

ISBNs :

9781479901128

Database :

Complementary Index

Journal :

2013 IEEE International Reliability Physics Symposium (IRPS)

Publication Type :

Conference

Accession number :

89798525

Full Text :

https://doi.org/10.1109/IRPS.2013.6531952