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Power MOSFET Package Shrinks.
- Source :
- Power Electronics Technology; Dec2002, Vol. 28 Issue 12, p36, 2p
- Publication Year :
- 2002
-
Abstract
- Focuses on the MicroFET 3X2 MOSFET package with exposed drain pad which provides a true surface-mount alternative that improves thermal characteristics, current handling capability and on-resistance. Dependence of the junction-to-ambient thermal resistance on the size and mass of the copper board area; Temperature contour of the device.
- Subjects :
- ELECTRONICS
TECHNOLOGY
Subjects
Details
- Language :
- English
- ISSN :
- 15402800
- Volume :
- 28
- Issue :
- 12
- Database :
- Complementary Index
- Journal :
- Power Electronics Technology
- Publication Type :
- Periodical
- Accession number :
- 8880650