Temperature evolution during scanning electron beam processing of silicon.

Temperature profile evolutions produced by a scanning electron beam in crystalline silicon have been numerically calculated using a two-dimensional finite-element scheme. The temperature dependence of the different silicon properties as well as the electron penetration effects have been taken into account. Numerical calculations carried out at different conditions have been compared with experimental melting-threshold measurements using an electron beam with a Gaussian power density distribution. The good agreement between numerical calculations and experimental results proves the validity of the two-dimensional approach. [ABSTRACT FROM AUTHOR]