Time--and temperature-dependent wetting behavior of eutectic SnPb on Cu leadframes plated with...

Presents a study which investigated the morphology, cap diameter, and cross-sectional image of eutectic alloy of lead and tin (SnPb) solder caps as a function of varying surface films, reflow time, and reflow temperature. Experimental procedures used to conduct the study; How leadframe packaging for plastic encapsulated electronics products is associated to SnPb solder or similar solders; Results and discussion of the study.