Sintered Silver Joint Strength Dependence on Substrate Topography and Attachment Pad Geometry.

MLA

Wereszczak, Andrew A., et al. “Sintered Silver Joint Strength Dependence on Substrate Topography and Attachment Pad Geometry.” 2012 7th International Conference on Integrated Power Electronics Systems (CIPS), Jan. 2012, pp. 1–6. EBSCOhost, widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edb&AN=86516072&authtype=sso&custid=ns315887.

APA

Wereszczak, A. A., Vuono, D. J., Liang, Z., & Fox, E. E. (2012). Sintered Silver Joint Strength Dependence on Substrate Topography and Attachment Pad Geometry. 2012 7th International Conference on Integrated Power Electronics Systems (CIPS), 1–6.

Chicago

Wereszczak, Andrew A., Daniel J. Vuono, Zhenxian Liang, and Ethan E. Fox. 2012. “Sintered Silver Joint Strength Dependence on Substrate Topography and Attachment Pad Geometry.” 2012 7th International Conference on Integrated Power Electronics Systems (CIPS), January, 1–6. http://widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edb&AN=86516072&authtype=sso&custid=ns315887.