Reducing Parasitic Electrical Parameters with a Planar Interconnection Packaging Structure.

A novel packaging structure for medium power modules featuring power semiconductor switches sandwiched between two symmetric substrates that fulfill electrical conduction and insulation functions is presented. The power switches in a popular phase leg electrical topology are orientated in a face up/face down configuration. Large bonding areas between dies and substrates combined with a compact busbar interface allow this packaging technology to offer dramatic improvements in electrical conversion efficiency and electromagnetic interference containment. [ABSTRACT FROM PUBLISHER]