Side-by-side comparison between infrared and thermoreflectance imaging using a thermal test chip with embedded diode temperature sensors.

MLA

Kendig, Dustin, et al. “Side-by-Side Comparison between Infrared and Thermoreflectance Imaging Using a Thermal Test Chip with Embedded Diode Temperature Sensors.” 2012 28th Annual IEEE Semiconductor Thermal Measurement & Management Symposium (SEMI-THERM), Jan. 2012, pp. 344–47. EBSCOhost, https://doi.org/10.1109/STHERM.2012.6188871.

APA

Kendig, D., Yazawa, K., Marconnet, A., Asheghi, M., & Shakouri, A. (2012). Side-by-side comparison between infrared and thermoreflectance imaging using a thermal test chip with embedded diode temperature sensors. 2012 28th Annual IEEE Semiconductor Thermal Measurement & Management Symposium (SEMI-THERM), 344–347. https://doi.org/10.1109/STHERM.2012.6188871

Chicago

Kendig, Dustin, Kazuaki Yazawa, Amy Marconnet, Mehdi Asheghi, and Ali Shakouri. 2012. “Side-by-Side Comparison between Infrared and Thermoreflectance Imaging Using a Thermal Test Chip with Embedded Diode Temperature Sensors.” 2012 28th Annual IEEE Semiconductor Thermal Measurement & Management Symposium (SEMI-THERM), January, 344–47. doi:10.1109/STHERM.2012.6188871.