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Integrated RF Architectures in Fully-Organic SOP Technology.
- Source :
- IEEE Transactions on Advanced Packaging; May2002, Vol. 25 Issue 2, p136, 7p, 5 Black and White Photographs, 2 Diagrams, 2 Charts, 5 Graphs
- Publication Year :
- 2002
-
Abstract
- Presents the design, model, and measurement data of a radio frequency microwave multilayer transitions and integrated passives implemented in a multilayer organic system on package (SOP) technology. Discussion on the SOP technology; Definition of a multi-layer organic packaging; Role of embedded filters in wireless module applications.
- Subjects :
- MICROWAVE circuits
RADIO frequency
ELECTRONIC modulators
Subjects
Details
- Language :
- English
- ISSN :
- 15213323
- Volume :
- 25
- Issue :
- 2
- Database :
- Complementary Index
- Journal :
- IEEE Transactions on Advanced Packaging
- Publication Type :
- Academic Journal
- Accession number :
- 8607184
- Full Text :
- https://doi.org/10.1109/TADVP.2002.803261