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Smart Cutâ„¢ transfer of 300 mm [110] and (100) Si layers for hybrid orientation technology.

Authors :
Bourdelle, K.K.
Akatsu, T.
Sousbie, N.
Letertre, F.
Delprat, D.
Neyret, E.
Ben Mohamed, N.
Suciu, G.
Lagahe-Blanchard, C.
Beaumont, A.
Charvet, A.-M.
Papon, A.-M.
Kernevez, N.
Maleville, C.
Mazure, C.
Source :
2004 IEEE International SOI Conference (IEEE Cat. No.04CH37573); 2004, p98-99, 2p
Publication Year :
2004

Details

Language :
English
ISBNs :
9780780384972
Database :
Complementary Index
Journal :
2004 IEEE International SOI Conference (IEEE Cat. No.04CH37573)
Publication Type :
Conference
Accession number :
82110816
Full Text :
https://doi.org/10.1109/SOI.2004.1391572