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Stacked-chip packaging: electrical, mechanical, and thermal challenges.
- Source :
- 2004 Proceedings 54th Electronic Components & Technology Conference (IEEE Cat. No.04CH37546); 2004, p1608-1608, 1p
- Publication Year :
- 2004
Details
- Language :
- English
- ISBNs :
- 9780780383654
- Database :
- Complementary Index
- Journal :
- 2004 Proceedings 54th Electronic Components & Technology Conference (IEEE Cat. No.04CH37546)
- Publication Type :
- Conference
- Accession number :
- 82011627
- Full Text :
- https://doi.org/10.1109/ECTC.2004.1320330