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Wafer level thin film encapsulation for MEMS.

Authors :
Gillot, C.
Pornin, J.L.
Arnaud, A.
Lagoutte, E.
Sillon, N.
Souriau, J.C.
Source :
2005 7th Electronic Packaging Technology Conference; 2005, p5-5, 1p
Publication Year :
2005

Details

Language :
English
ISBNs :
9780780395787
Database :
Complementary Index
Journal :
2005 7th Electronic Packaging Technology Conference
Publication Type :
Conference
Accession number :
81687541
Full Text :
https://doi.org/10.1109/EPTC.2005.1614401
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