“Condition-based” dummy fill insertion method based on ECP and CMP predictive models.

Details

Language :

English

ISBNs :

9781424464548

Database :

Complementary Index

Journal :

2010 11th International Symposium on Quality Electronic Design (ISQED)

Publication Type :

Conference

Accession number :

81656380

Full Text :

https://doi.org/10.1109/ISQED.2010.5450461