Enhancing the electromigration resistance of copper interconnects.

Authors :: Dixit, G.
Padhi, D.
Gandikota, S.
Yahalom, J.
Parikh, S.
Yoshida, N.
Shankaranarayanan, K.
Chen, J.
Maity, N.
Yu, J.
Source :: Proceedings of the IEEE 2003 International Interconnect Technology Conference (Cat. No.03TH8695); 2003, p162-164, 3p
Publication Year :: 2003

Language :: English
ISBNs :: 9780780377974
Database :: Complementary Index
Journal :: Proceedings of the IEEE 2003 International Interconnect Technology Conference (Cat. No.03TH8695)
Publication Type :: Conference
Accession number :: 81653810
Full Text :: https://doi.org/10.1109/IITC.2003.1219742